Engineers build artificial intelligence chip

Science Daily  June 13, 2022
An international team of researchers (USA – MIT, University of Cincinnati, Harvard University, Stanford University, Washington University, Lawrence Berkeley National Laboratory, Lawrence Berkeley National Laboratory, South Korea, China) has developed stackable and replaceable hetero-integrated chips that use optoelectronic device arrays for chip-to-chip communication and neuromorphic cores based on memristor crossbar arrays for highly parallel data processing. They created a system with these chips that can directly classify information from a light-based image source.The system was modified by inserting a preprogrammed neuromorphic denoising layer that improves the classification performance in a noisy environment. Their technology can be used to vertically stack a diverse range of functional layers and could provide energy-efficient sensor computing systems for edge computing applications…read more. TECHNICAL ARTICLE 

Integration technologies of sensor computing systems for edge computing. Credit: Nature Electronics 2022

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