Engineers build artificial intelligence chip

Science Daily  June 13, 2022 An international team of researchers (USA – MIT, University of Cincinnati, Harvard University, Stanford University, Washington University, Lawrence Berkeley National Laboratory, Lawrence Berkeley National Laboratory, South Korea, China) has developed stackable and replaceable hetero-integrated chips that use optoelectronic device arrays for chip-to-chip communication and neuromorphic cores based on memristor crossbar arrays for highly parallel data processing. They created a system with these chips that can directly classify information from a light-based image source.The system was modified by inserting a preprogrammed neuromorphic denoising layer that improves the classification performance in a noisy environment. Their technology can […]