Electronic stickers to streamline large-scale ‘Internet of Things’

Purdue University  July 16, 2018 Researchers at Purdue University developed a wafer-recyclable, environment-friendly transfer printing process that enables the wafer-scale separation of high-performance thin-film nanoelectronics in a defect-free manner that enables multiple reuses of the wafer. The interfacial delamination is enabled through a controllable cracking phenomenon in a water environment at room temperature. The technique cuts down manufacturing costs by using a single wafer to build a nearly infinite number of thin films. The film can peel off at room temperature… read more. TECHNICAL ARTICLE