Phys.org September 26, 2022 Thermally conductive films with large in-plane anisotropy to prevent thermal interference between heat sources in close proximity and to cool in other directions by diffusion are important for efficient heat dissipation of thin electronic devices. Researchers in Japan have developed flexible composite films composed of a uniaxially aligned carbon-fiber filler within a cellulose nanofiber matrix through liquid-phase three-dimensional patterning. The film exhibited a high in-plane thermal conductivity anisotropy of 433%, with combined properties of a thermal conductivity of 7.8 W/mK in the aligned direction and a thermal conductivity of 1.8 W/mK in the in-plane orthogonal direction. […]
Category Archives: Heat dissipation
Researchers develop new measurements for designing cooler electronics
Science Daily December 21, 2021 Often the thermal energy generated in the device during operation must cross several dissimilar materials during the process and the interface between these materials can impede heat flow. An international team of researchers (Georgia Institute of Technology, University of Notre Dame, UC Irvine, US.S. Naval Research Laboratory, UCLA, Oak Ridge National Laboratory, South Korea) observed the interfacial phonon modes experimentally at a high-quality Si-Ge epitaxial interface by using Raman Spectroscopy and high-energy resolution electron energy-loss spectroscopy (EELS). To figure out the role of interfacial phonon modes in heat transfer at interfaces, they used time-domain thermoreflectance […]