Purdue University July 16, 2018
Researchers at Purdue University developed a wafer-recyclable, environment-friendly transfer printing process that enables the wafer-scale separation of high-performance thin-film nanoelectronics in a defect-free manner that enables multiple reuses of the wafer. The interfacial delamination is enabled through a controllable cracking phenomenon in a water environment at room temperature. The technique cuts down manufacturing costs by using a single wafer to build a nearly infinite number of thin films. The film can peel off at room temperature… read more. TECHNICAL ARTICLEÂ
Researchers have designed peelable electronic films that can be cut and pasted onto any object to achieve desired functions. (Purdue University image/Chi Hwan Lee)