Phys.org April 24, 2024 There is an existing model that diamond can be grown using liquid metals only at both high pressure and high temperature. Researchers in South Korea described the growth of diamond crystals and polycrystalline diamond films with no seed particles using liquid metal but at 1 atm pressure and at 1,025 °C. Diamond grew in the subsurface of liquid metal composed of gallium, iron, nickel and silicon, by catalytic activation of methane and diffusion of carbon atoms into and within the subsurface regions. They found that the supersaturation of carbon in the liquid metal subsurface led to the nucleation […]
Tag Archives: Diamond
Combining diamond and lithium niobate as a core component for future quantum technologies
Nanowerk December 15, 2023 Negatively charged group-IV color centers in diamond are promising candidates for quantum memories as they combine long storage times with excellent optical emission properties and an optically addressable spin state. However, as a material, diamond lacks the many functionalities needed to realize scalable quantum systems. Thin-film lithium niobate (TFLN), in contrast, offers several useful photonic nonlinearities, including the electro-optic effect, piezoelectricity, and capabilities for periodically poled quasi-phase matching. Researchers at Stanford University have presented highly efficient heterogeneous integration of diamond nanobeams containing negatively charged silicon-vacancy (SiV) centers with TFLN waveguides. They observed greater than 90% transmission […]
A novel laser slicing technique for diamond semiconductors
Nanowerk August 1, 2023 Laser slicing is a technique of slicing materials along cracks formed by scanning a focused ultrashort-pulse laser beam inside the materials. Researchers in Japan proposed a novel slicing technique to fabricate diamond wafers and demonstrate slicing at the {100} surface. Cracks parallel to the {100} plane are needed to fabricate the wafer. However, crystal materials contain a cleavage plane at the {111} plane, which cracks easily. Typically, cracks propagate not only along the {100} plane, which was the intended slicing plane, but also along the {111} plane, which increased the kerf loss. To restrict these undesirable […]