Nanowerk August 1, 2023
Laser slicing is a technique of slicing materials along cracks formed by scanning a focused ultrashort-pulse laser beam inside the materials. Researchers in Japan proposed a novel slicing technique to fabricate diamond wafers and demonstrate slicing at the {100} surface. Cracks parallel to the {100} plane are needed to fabricate the wafer. However, crystal materials contain a cleavage plane at the {111} plane, which cracks easily. Typically, cracks propagate not only along the {100} plane, which was the intended slicing plane, but also along the {111} plane, which increased the kerf loss. To restrict these undesirable cracks, they devised a laser irradiation sequence and developed a cutting method that restricted cracking along the {111} plane. According to the researchers slicing technology will potentially pave the way toward the realization of diamond semiconductors based on diamond wafers with {100} surfaces… read more. Open Access TECHNICAL ARTICLEÂ
Graphical abstract. Credit: Diamond and Related Materials, Volume 136, June 2023, 110045Â