Nanowerk  August 1, 2023 Laser slicing is a technique of slicing materials along cracks formed by scanning a focused ultrashort-pulse laser beam inside the materials. Researchers in Japan proposed a novel slicing technique to fabricate diamond wafers and demonstrate slicing at the {100} surface. Cracks parallel to the {100} plane are needed to fabricate the wafer. However, crystal materials contain a cleavage plane at the {111} plane, which cracks easily. Typically, cracks propagate not only along the {100} plane, which was the intended slicing plane, but also along the {111} plane, which increased the kerf loss. To restrict these undesirable […]