Chipmakers Test Ferroelectrics as a Route to Ultralow-Power Chips

IEEE Spectrum  February 26, 2018
Researchers at a company in the US chose a ferroelectric material that does not require ions or atoms to relocate which slows things down in ferroelectric materials. In their experimental 14-nm transistors, clouds of electrons around silicon-doped hafnium dioxide experience the polarization. Ring oscillators made with these transistors can switch at the same frequency as those made with the usual recipe, yet they require just 54 mV to achieve a tenfold increase in the current. Their devices require a 3- to 8-nm-thick layer of ferroelectric material, which is still relatively thick… read more. Related TECHNICAL ARTICLE

Power Down: Chipmakers are adding a thin layer of ferroelectric material to transistors, including fin-shaped field-effect transistors (FinFETs). Illustration: Emily Cooper

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