Phys.org February 28, 2024 An ideal integrated microwave photonics (MWP) processing platform should have both an efficient and high-speed electro-optic modulation block to faithfully perform microwave–optic conversion at low power and a low-loss functional photonic network to implement various signal-processing tasks, and large-scale, low-cost manufacturability. An international team of researchers (Hong Kong, UK, China) demonstrated such an engine based on a 4-inch wafer-scale thin-film lithium niobate platform. It could perform multipurpose tasks with processing bandwidths of up to 67 GHz at CMOS-compatible voltages. They achieved ultrafast analogue computation. They demonstrated these functions to show three proof-of-concept applications: solving ordinary differential equations, […]
Tag Archives: Wireless communication
Engineers fabricate a chip-free, wireless electronic ‘skin’
MIT News August 18, 2022 Flexible electronic materials (e-skins) can be limited by the need to include rigid components. A range of techniques have emerged to bypass this problem, including approaches for wireless communication and charging based on silicon, carbon nanotubes, or conducting polymers. An international team of researchers (USA – MIT, University of Virginia, South Korea) has developed a chip-less wireless e-skin based on surface acoustic wave sensors made of freestanding ultrathin single-crystalline piezoelectric gallium nitride membranes. It offers highly sensitive, low-power, and long-term sensing of strain, ultraviolet light, and ion concentrations in sweat. They demonstrated weeklong monitoring of […]