Science Daily June 1, 2023 Researchers in South Korea experimentally demonstrated boosted in-plane thermal conduction by surface plasmon polaritons (SPPs) propagating along a thin Ti film on a glass substrate. Due to the lossy nature of metal, SPPs could propagate over centimeter-scale distances even along a supported metal film, and the resulting ballistic heat conduction could be quantitatively validated. For a 100-nm-thick Ti film on a glass substrate, a significant enhancement of in-plane thermal conductivity compared to bulk value (∼25%) was experimentally shown. According to the researchers their work will provide a new avenue to employ SPPs for heat dissipation […]
Tag Archives: Heat dissipation
Electronic bridge allows rapid energy sharing between semiconductors
Phys. org January 4, 2023 A team of researchers in the US (SLAC National Accelerator Laboratory, Stanford University, UC Berkeley) studied devices consisting of stacked monolayers of WSe2 and WS2. They found that the WSe2 layer heated up, as expected, and the WS2 layer also heated up in tandem, suggesting a rapid transfer of heat between layers. By contrast, when they didn’t excite electrons in the WSe2 and heated the heterostructure using a metal contact layer instead, the interface between WSe2 and WS2 transmitted heat very poorly, confirming previous reports. It was surprising to see the two layers heat up […]
Cranking the Power on Radar Capabilities
DARPA November 23, 2022 Technologies for Heat Removal in Electronics at the Device Scale (THREADS) aims to overcome the thermal limits inherent to internal circuitry operations in general, and to critical power-amplifying functions specifically. THREADS targets thermal management challenges at the transistor level. Central to this effort will be reducing the thermal resistance involved in dissipating internal heat without degrading performance or increasing the footprint of the transistors key to advancing radar capabilities. Wide bandgap transistors, such as gallium nitride (GaN), were developed specifically to improve output density in power amplifiers and further order-of-magnitude increase in power output is possible […]