Science Daily June 1, 2023
Researchers in South Korea experimentally demonstrated boosted in-plane thermal conduction by surface plasmon polaritons (SPPs) propagating along a thin Ti film on a glass substrate. Due to the lossy nature of metal, SPPs could propagate over centimeter-scale distances even along a supported metal film, and the resulting ballistic heat conduction could be quantitatively validated. For a 100-nm-thick Ti film on a glass substrate, a significant enhancement of in-plane thermal conductivity compared to bulk value (∼25%) was experimentally shown. According to the researchers their work will provide a new avenue to employ SPPs for heat dissipation along a supported thin film, which can be readily applied to mitigate hot-spot issues in microelectronics… read more. TECHNICAL ARTICLEÂ
Researchers find a way to reduce the overheating of semiconductor devices
Posted in Semiconductor devices and tagged Device overheating, Heat dissipation, Microelectronics, S&T South Korea.