Next Big Future   September 10, 2023 The semiconductor industry is expected to evolve from 2D to 3D DRAM over the next five to eight years based on current technical capabilities. Lam is simulating DRAM’s untested future by creating proposals for what 3D DRAM architecture could look like. Some suggestions for a 3D DRAM to address include – Scaling issues, Stacking challenges, Shrinking footprints, Innovative connections, Via arrays, Process requirements. Driving higher density of bits by reducing the footprint of the capacitors by making them taller will not be possible because etch and deposition processes for capacitor fabrication cannot handle the […]