Flaky compound to prevent computer chips from getting fried

Phys.org  July 4, 2023
To address overheating in microchip-based devices researchers in Russia 3D printed a model of a composite radiator with different boron nitride fillings. The measured absolute values of the thermal conductivity of such a composite in the temperature range of 3–300 K strongly depend on the concentration of boron nitride. Filling the photopolymer with boron nitride led to a change in the behavior of the volt–current curves, which might have been associated with the occurrence of percolation currents during the deposition of boron nitride. The ab initio calculations showed the behavior and spatial orientation of BN flakes under the influence of an external electric field at the atomic level. According to the researchers these results demonstrated the potential use of photopolymer-based composite materials filled with boron nitride, which are manufactured using additive techniques, in modern electronics… read more. Open Access TECHNICAL ARTICLE

(a) SEM image of hBN particles, and (b) particle size distribution (PSD) histogram.
Credit: Polymers Volume 15 Issue 5 10.3390/polym15051214 

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