University of Illinois researchers demonstrate new capability for cooling electronics

EurekAlert  February 1, 2020
Air jet cooling systems are not widely used today because of their complexity and weight. A team of researchers in the US (Arizona State University, University of Illinois) has demonstrated a new type of air jet cooler that overcomes previous barriers to jet cooling systems. Using additive manufacturing and strong polymer materials, the researchers created an air jet cooling system that can direct high-speed air onto multiple electronics hot spots. The cooling system can withstand the harsh conditions associated with high-speed air jets. The design freedom of additive manufacturing allows creating cooling solutions that have sizes and shapes not previously possible. The research opens new opportunities for thermal management…read more. TECHNICAL ARTICCLE

This is a diagram of air jet impingement cooling of electronic devices using additively manufactured nozzles. Credit: Bill King, Mechanical Science & Engineering, Grainger Engineering

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