Science Daily April 1, 2019
In the existing techniques for the preparation of copper nanoparticles, impurities can be removed via extremely high temperatures hence those prepared at room temperature could not solidify into usable parts. Researchers in Japan have synthesised copper nanoparticles with the ability to solidify at much lower temperatures, remain pure; they altered the structure of the copper nanoparticles and rendered them more stable so that they do not degrade at low temperatures. With the new technique copper nanoparticle-based materials can be utilized in various types of on-demand flexible and wearable devices which can be fabricated easily via printing processes at a very low cost…read more. Open Access TECHNICAL ARTICLE
Copper nanopastes with low-temperature sintering property for printed electronics and die attachment. Credit: Kiyoshi Kanie