Electronic bridge allows rapid energy sharing between semiconductors

Phys. org  January 4, 2023 A team of researchers in the US (SLAC National Accelerator Laboratory, Stanford University, UC Berkeley) studied devices consisting of stacked monolayers of WSe2 and WS2. They found that the WSe2 layer heated up, as expected, and the WS2 layer also heated up in tandem, suggesting a rapid transfer of heat between layers. By contrast, when they didn’t excite electrons in the WSe2 and heated the heterostructure using a metal contact layer instead, the interface between WSe2 and WS2 transmitted heat very poorly, confirming previous reports. It was surprising to see the two layers heat up […]

A possible new way to cool computer chips

Phys.org  February 26, 2020 Researchers at Stanford University sought to imagine a new type of cooling device that would work by reversing the heat exchange between an object and its environment by adding energy to radiated photons—in theory, doing so should carry away more heat. They developed theoretical and computational formalisms to describe thermal radiation from temporally modulated systems. They showed that such a modulation results in a photon-based active cooling mechanism. This mechanism has a high thermodynamic performance that can approach the Carnot limit. The work points to exciting new avenues in active, time-modulated control of thermal emission for […]