Researchers discover new ultra strong material for microchip sensors

Phys.org  November 2, 2023 Although there have been remarkable strides in achieving low-dissipation mechanical sensors by utilizing high tensile stress, the performance of even the best strategy is limited by the tensile fracture strength of the resonator materials. An international team of researchers (the Netherlands, USA – Brown University) found that a wafer-scale amorphous thin film of silicon carbide (SiC) material exhibited an ultimate tensile strength of over 10 GPa, reaching the regime reserved for strong crystalline materials and approaching levels experimentally shown in graphene nanoribbons. They fabricated amorphous SiC strings with high aspect ratios with mechanical modes exceeding quality […]