Science Daily  April 13, 2020 Reducing the size of electro-optical modulators allows increased packaging density, which is vital on a chip. By heterogeneously adding a thin material layer of indium tin oxide to the silicon photonic waveguide chip, a team of researchers in the US (George Washington University, UT Austin) has demonstrated an optical index change 1,000 times larger than silicon. Unlike many designs based on resonators this spectrally-broadband device is stable against temperature changes and allows a single fiber-optic cable to carry multiple wavelengths of light, increasing the amount of data that can move through a system…read more. TECHNICAL […]